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Technology
Item |
Capability |
Material Brand |
ShengYi, ITEQ, NanYa, TUC, EMC, Kingboard, Grace, GoWorld, Ventec, Rogers |
Layers Count |
1 - 18 layers, HDI 3+N+3 |
Laminate Material |
FR-4, CEM1, CEM3, High TG, High CTI,High Frequency, Halogen-free, Heavy Copper material |
Finished Board Thickness |
0.4 - 3.2mm (16 - 128 mil) |
Max. Panel Size |
520mm x1200mm |
Outline Tolerance |
± 0.10mm |
Min. Line Width/Spacing |
2.5mil (0.064mm)/2.5mil (0.064mm) |
Impedance Control |
+/- 10% ohm |
Min. BGA PAD Size |
8mil |
Min. Spacing between BGA PAD and Track |
3.0mil |
Min. Spacing between Hole and Innerlayer Track |
6mil |
Hole Copper Thickness |
Automotive PCB: min.25um, Others:avg.25um min.20um (IPC-III) |
Copper Thickness |
18um,35um,70um,105um,140um,175um, 210um (0.5oz – 6oz) |
Min. Drilling Hole |
Through Hole: 0.15mm (6mil); Blind/Buried Hole: 0.1mm(4mil) |
Max. Aspect ratio |
12:1(Hole>0.30MM);8:1(Hole≤0.30MM) |
Soldermask Color |
Green, Blue, Black, White, Yellow, Red, etc. |
Min. Soldermask Dam |
0.076mm(3mil) |
Surface Finish |
Immersion Gold, OSP, HASL, LF HASL, Immersion Silver, Immersion Tin, Plate Gold |
Base Material
Cost-effective Solution
There are many options on PCB base materials, while it's not easy to choose the most suitable one for your PCB projects. With our expert know-how and professional technical knowledge, YSL Electronic can provide you with guidance and assistance in material selection and PCB specifications. We can offer:
● FR4, CEM1, CEM3, Rigid materials: ShengYi, ITEQ, NanYa, TUC, EMC, Kingboard, Grace, GoWorld, Rogers
● Heavy Copper materials: 210um base copper thickness and more
● High TG materials: S1000-2M, IT180, KB6167, NP-170TL
● Halogen-free materials: S1150G, S1170G, HF-140
● IMS (Aluminum base, Copper base): Bergquist HPL, Ventec VT, Totking, Polytronics TCB, Doosan DST, Denka, Arlon
● High Frequency: Rogers, Neltec, Arlon, Taconic
Techni
Special Techniques Available
We are a leading PCB manufacturer in China who continuously push the boundaries with a focus on quality and innovation. With over 20 years experience on R&D and devoted to develop new technologies and products. Some special features such as:
● Blind & Buried Hole
● Plated Half Hole
● Epoxy Filled Via
● Countersink Hole/Screw Hole
● VIPPO and POFV
● Plated Edge
● Carbon print
● Peelable Soldermask
● Depth Control Routing
● Jumping V-cut
● Countersink Hole/Screw Hole
● Edge Connectors/Golden Fingers